Inqubo yokusika ukukhanya ihlukaniswe

Inqubo yokusika ukukhanya ihlukaniswe yaba:
1. Ukusika kwe-vaporization:
Ngaphansi kokushisisa kwe-laser ye-high-power density beam, izinga lokushisa elingaphezulu lezinto likhuphuka ngokushesha lifike endaweni yokubilisa, okwanele ukugwema ukuncibilika okubangelwa ukuqhutshwa kwe-thermal. Ngenxa yalokho, okunye okokusebenza kuhwamuka kube isitimu futhi kuyanyamalala, kuyilapho ezinye zipheshulwa njenge-ejecta kusukela phansi komthungo wokusika ngokugeleza kwegesi eyisiza.
2. Ukuncibilika kokusika:
Uma ukuminyana kwamandla ohlaka lwe-laser yesigameko ludlula inani elithile, okokusebenza okungaphakathi kwephoyinti lokukhanya kwemisebe kuqala ukuhwamuka, kwenze izimbobo. Uma le mbobo encane yakhiwe, izosebenza njenge-blackbody ukuze imunce wonke amandla e-beam yesigameko. Imbobo encane izungezwe udonga lwensimbi oluncibilikisiwe, bese kuthi i-airflow coaxial eyisiza enohlaka isuse into encibilikisiwe ezungeze imbobo. Njengoba i-workpiece ihamba, imbobo encane ihamba ngokuvundlile endaweni yokusika ukuze yenze umthungo wokusika. I-laser beam iyaqhubeka nokukhanya emaphethelweni angaphambili alo mthungo, futhi into encibilikisiwe iqhubeka njalo noma ishaywa umoya isuka ngaphakathi komthungo.
3. Ukusika ukuncibilika kwe-oxidation:
Ukuncibilika kokusika ngokuvamile kusebenzisa amagesi angenayo. Uma kusetshenziswa umoya-mpilo noma amanye amagesi asebenzayo esikhundleni salokho, okubalulekile kubaselwa ngaphansi kokukhanya kwe-laser beam, futhi ukusabela kwamakhemikhali anobudlova kwenzeka nge-oxygen ukukhiqiza omunye umthombo wokushisa, okubizwa ngokuthi i-oxidation melting cutting. Incazelo eqondile imi kanje:
(1) Ingaphezulu lezinto ezibonakalayo lishiselwa ngokushesha kuzinga lokushisa lomlilo ngaphansi kwemisebe ye-laser beam, bese libhekana nokusabela okunamandla okuvutha komoyampilo, kudedela inani elikhulu lokushisa. Ngaphansi kwesenzo salokhu kushisa, izimbobo ezincane ezigcwele umusi ziyakhiwa ngaphakathi kwempahla, zizungezwe izindonga zensimbi ezincibilikisiwe.
(2) Ukudluliswa kwezinto ezivuthayo ku-slag kulawula izinga lokushiswa komoyampilo nensimbi, kuyilapho isivinini lapho umoya-mpilo usakazeka khona ku-slag ukuze ufinyelele phambili ekuthungeleni siphinde sibe nomthelela omkhulu kuzinga lokuvutha. Ukuphakama kwezinga lokugeleza komoyampilo, kushesha ukusabela kwamakhemikhali omlilo kanye nezinga lokususwa kwe-slag. Yiqiniso, ukuphakama kwezinga lokugeleza kwe-oksijeni, kungcono, ngoba ukugeleza okusheshayo kungabangela ukupholisa okusheshayo kwemikhiqizo yokusabela, okungukuthi i-oxides yensimbi, ekuphumeni komthungo wokusika, okubuye kube yingozi kwikhwalithi yokusika.
(3) Ngokusobala, kunemithombo yokushisa emibili ohlelweni lokuncibilika kwe-oxidation, okuyi-laser irradiation energy namandla ashisayo akhiqizwa ukusabela kwamakhemikhali phakathi kwe-oxygen nensimbi. Kulinganiselwa ukuthi ukushisa okukhishwe ukusabela kwe-oxidation ngesikhathi sokusika insimbi kubala cishe u-60% wawo wonke amandla adingekayo ekusikeni. Kusobala ukuthi ukusebenzisa umoya-mpilo njengegesi elisizayo kungafinyelela isivinini esikhulu sokusika uma kuqhathaniswa namagesi angasebenzi.
(4) Enqubweni yokusika yokuncibilika kwe-oxidation enemithombo emibili yokushisa, uma isivinini somlilo we-oxygen siphakeme kunejubane lokunyakaza kwe-laser beam, umphetho wokusika ubonakala ubanzi futhi unzima. Uma isivinini sokunyakaza kwe-laser beam sishesha ukwedlula isivinini sokusha somoya-mpilo, umsele uzoba mncane futhi ubushelelezi. [1]
4. Lawula ukusika ukuphuka:
Okwezinto ezithambile ezijwayele ukulimala okushisayo, ukusika ngesivinini esikhulu futhi okulawulwayo ngokushisa kwe-laser beam kubizwa ngokuthi ukusika okulawulwayo kokuphuka. Okuqukethwe okuyinhloko kwale nqubo yokusika ukushisa indawo encane yezinto eziphukayo nge-laser beam, okubangela i-gradient enkulu yokushisa kanye nokuguqulwa okunzima kwemishini kuleyo ndawo, okuholela ekwakhekeni kwemifantu kundaba. Inqobo nje uma i-balanced heat gradient igcinwa, i-laser beam ingaqondisa imifantu ukuthi yenzeke kunoma iyiphi indlela oyifunayo.