Inkqubo yokusika ukukhanya yahlulwe ibe:
1. Ukusika umphunga:
Ngaphantsi kokufudumeza kwe-laser ye-high-power density beam, iqondo lokushisa eliphezulu lezinto eziphathekayo likhuphuka ngokukhawuleza kwiqondo lokushisa elibilisayo, elaneleyo ukuphepha ukunyibilika okubangelwa ukuqhutyelwa kwe-thermal. Ngenxa yoko, ezinye zezinto ziyaqhuma zibe ngumphunga kwaye zinyamalale, ngelixa ezinye zivuthelwa njenge-ejecta ukusuka ezantsi komthungo wokusika ngokuhamba kwegesi encedisayo.
2. Ukunyibilika ukusika:
Xa uxinaniso lwamandla lwesiganeko se-laser beam ludlula ixabiso elithile, izinto ezingaphakathi kwendawo ye-irradiation iqala ukuphuphuma, yenze imingxuma. Nje ukuba lo mngxuma umncinci wenzekile, uya kusebenza njenge-blackbody ukufunxa onke amandla omqa wesiganeko. Umngxuma omncinci ujikelezwe ludonga lwentsimbi etyhidiweyo, kwaye emva koko i-airflow coaxial encedisayo kunye nomqadi ithwala imathiriyeli etyhidiweyo ejikeleze umngxuma. Njengoko i-workpiece ihamba, umgodi omncinci uhamba ngokuthe tye kwinqanaba lokusika ukuze wenze umthungo wokusika. Umqa we-laser uyaqhubeka nokukhanya ecaleni komphetho wangaphambili walo mthungo, kwaye izinto ezinyityilisiweyo ziqhubeka ngokuqhubekayo okanye zivuthelwa zisuka ngaphakathi kumthungo.
3. Ukusika ukunyibilika kwe-oxidation:
Ukunyibilika ukusika ngokuqhelekileyo kusebenzisa iigesi ezingenayo. Ukuba i-oksijeni okanye ezinye iigesi ezisebenzayo zisetyenzisiweyo endaweni yoko, izinto eziphathekayo zivutha phantsi kwe-irradiation ye-laser beam, kwaye ukusabela kweekhemikhali ezinobundlobongela kwenzeka nge-oksijini ukuvelisa omnye umthombo wokushisa, obizwa ngokuba yi-oxidation melting cutting. Inkcazo ethile yile ilandelayo:
(1) Umphezulu wezinto eziphathekayo ufudunyezwa ngokukhawuleza kwiqondo lokushisa elivuthayo phantsi kwe-radiation ye-laser beam, kwaye emva koko ungene kwi-reactions yokutsha okukhulu kunye ne-oxygen, ukukhulula ubushushu obukhulu. Ngaphantsi kwesenzo solu bushushu, izimbobo ezincinci ezizaliswe ngumphunga zenziwe ngaphakathi kwezinto, zijikelezwe ngeendonga zetsimbi ezityhidiweyo.
(2) Ukudluliselwa kwezinto ezivuthayo kwi-slag kulawula izinga lokutsha kwe-oksijini kunye nesinyithi, ngelixa isantya apho i-oksijini isasazeka kwi-slag ukufikelela kwi-ignition front nayo inempembelelo ebalulekileyo kwisantya sokutsha. Okukhona uphezulu umyinge wokuhamba kweoksijini, kokukhona isantya sokutsha kweekhemikhali sokutsha kunye nesantya sokususwa kwe-slag. Ngokuqinisekileyo, okukhona uphezulu umlinganiselo wokuhamba kweoksijini, kungcono, kuba ukukhawuleza kwesantya sokuhamba kunokubangela ukupholisa ngokukhawuleza kweemveliso zokusabela, ezizezi i-oxides zetsimbi, ekuphumeni komthungo wokusika, nto leyo eyingozi kumgangatho wokusika.
(3) Ngokucacileyo, kukho imithombo emibini yobushushu kwinkqubo ye-oxidation melting cutting, oko kukuthi i-laser irradiation energy kunye ne-thermal energy eyenziwa yi-chemical reaction phakathi kwe-oksijini kunye nesinyithi. Kuqikelelwa ukuba ukushisa okukhutshwe yi-oxidation reaction ngexesha lokusika i-akhawunti yensimbi malunga ne-60% yamandla onke afunekayo ukusika. Kuyabonakala ukuba ukusebenzisa i-oksijini njengegesi encedisayo kunokufikelela kwizantya eziphezulu zokusika xa kuthelekiswa neegesi ze-inert.
(4) Kwinkqubo yokusika i-oxidation melting kunye nemithombo emibini yokushisa, ukuba isantya sokutshisa i-oksijini siphezulu kunesantya sokuhamba kwe-laser beam, i-seam yokusika ibonakala ibanzi kwaye ibuhlungu. Ukuba isantya sokuhamba kwe-laser beam sihamba ngokukhawuleza kunesantya sokutsha se-oksijini, i-slit ephumayo iya kuba yincinci kwaye igudileyo. [1]
4. Lawula ukusika ukwaphuka:
Kwizinto ezinqabileyo ezijongene nomonakalo we-thermal, ukusika kwesantya esiphezulu kunye nokulawulwayo ngokufudumeza kwe-laser beam kubizwa ngokuba yi-controlled fracture cut. Umxholo oyintloko wale nkqubo yokusika ukutshisa indawo encinci yezinto ezinqabileyo kunye ne-laser beam, ebangela i-gradient enkulu ye-thermal kunye ne-deformation enzima yomatshini kuloo ndawo, okubangelwa ukubunjwa kweentanda kwizinto eziphathekayo. Ngethuba nje i-gradient yokufudumala igcinwe, i-laser beam inokukhokela iintanda ukuba zenzeke kulo naliphi na icala elifunekayo.
Ixesha lokuposa: Sep-09-2025